发明名称 LAMINATING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To laminate a transfer layer on a substrate at a high speed with high positional accuracy without protruding the transfer layer and without generating the thickness irregularity in the transfer layer. SOLUTION: A long laminated film 1 is unwound from a film unwinding part 2 to be guided to a substrate processing part 3 in a state fitted with a cover film. Heating bars are arranged to the substrate processing part 3 so as to be matched with the interval between substrates and this interval coincides with the interval between continuously charged substrates or the width of the non-laminated parts of the substrate end parts. The heating bars are pressed to the film through the cover film to melt and separate a resist layer across the heating bars. The film 1 is continuously sent to a laminating roll part. The substrate to which the resist is transferred is heated to desired temp. by a preheater 7 to be sent to a laminating part and the film is laminated to the substrate by a pair of laminating rolls 10, 11 and the base film is immediately peeled from the substrate.</p>
申请公布号 JP2000246861(A) 申请公布日期 2000.09.12
申请号 JP19990054870 申请日期 1999.03.03
申请人 HITACHI CHEM CO LTD 发明人 OKADA NAOTO;SHIMAZAKI TOSHIKATSU
分类号 H05K3/06;B29C65/00;B29C65/78;B29L9/00;B32B37/00;(IPC1-7):B32B31/18 主分类号 H05K3/06
代理机构 代理人
主权项
地址