| 摘要 |
PROBLEM TO BE SOLVED: To advance the productivity of IC card by providing a plurality of IC modules on the tape substrate, and puling out IC module parts from the tape substrate to subsequently be transferred to the card substrate, and then making the cut off IC modules into card through is deployment into recessed part of the card substrate. SOLUTION: A plurality of IC modules 21 are provided on the tape substrate 20, and one IC module 21 is punched out of the tape substrate 20 by the use of a punching member 30. Next, the pouched out IC module 21 is mounted on the card substrate 22 via an adhesive. The card substrate 22 is formed with a recessed part 26 in conformity with the configuration of the IC modules, and a conveyor means is controlled to position them correctly in these recessed part. After that, the IC module in preferably compressed in order to obtain an adhesive force to the card substrate 22, and in the case of employing a heat curable adhesive, heat-pressure adhesion is effectuated for a predetermined period of time after being mounted on the recessed part 26, thus the manufacturing of an IC card is completed. |
