| 摘要 |
PROBLEM TO BE SOLVED: To allow a semiconductor-sealing mold to be cleaned automatically safely, and prevent the lowering of productivity through cleaning. SOLUTION: The cleaning apparatus for a semiconductor sealing mold is composed of a jig 1 for holding a seat-like cleaning material, a jig conveying device 7 for shifting the jig 1 to at least a seat setting position and a waiting position, a cleaning material-feeding means for holding the sheet-like cleaning material, a cleaning material setting head for removing the sheet-like cleaning material from the cleaning material feeding means to subsequently be set on the jig 1, and a jig loader 18 for setting the jig 1 on the conveying device at a predetermined position of the mold and removing used cleaning material from the mold.
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