| 摘要 |
A connecting board for electrically and mechanically connecting a base plate such as a circuit board having disposed thereon an IC chip to a mounting board such as a motherboard. The connecting board includes a substrate having a plurality of through holes, a plurality of soft metal bodies which are deformable with ease and which are mounted in the through holes, and a plurality of solder layers disposed on upper and lower end portions of the soft metal bodies. The soft metal bodies are mounted in the through holes by disposing soft metal pieces at end portions of the through holes, heating and melting and allowing them to be poured into the through holes. The solder layers are disposed on the upper and lower end portions of the soft metal bodies by using transfer jigs each having a plurality of holes filled with solder paste, placing the jigs on the upper and lower end portions of the soft metal bodies, melting the solder paste and allowing them to be transferred onto the soft metal bodies. An assembly of the base plate, connecting board and mounting board can be obtained by placing them one upon another and heating them.
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