| 摘要 |
A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method. |
