发明名称 COOLING DEVICE FOR SEMICONDUCTOR POWER DEVICES
摘要 electrical engineering; static power converters. SUBSTANCE: thermosiphon-type cooling device has evaporator provided with vertical boiling channels intercommunicating on top through horizontal steam header and at bottom, through horizontal condensate header; it also has sealed case with vertical external ribs and condenser with internal condensation channels provided with upper steam inlet ports and lower condensate outlet ones. Horizontal steam header is connected to upper inlet steam ports via steam line. Condensate header is connected to lower condensate outlet ports through inclined condensate line. Boiling channels and some condensation channels are filled with intermediate liquid coolant. One or more semiconductor power devices are attached to external side of evaporator. External ribs of case are parallel to boiling and condensation channels. EFFECT: improved effectiveness of cooling device, reduced consumption of high-cost liquid dielectric. 12 cl, 2 dwg
申请公布号 RU2156012(C2) 申请公布日期 2000.09.10
申请号 RU19980117203 申请日期 1998.09.16
申请人 MORDOVSKIJ GOSUDARSTVENNYJ UNIVERSITET IMENI N.P. 发明人 KALIKANOV V.M.;FOMIN JU.A.;BARTANOV A.B.;PUZAKOV V.I.
分类号 H01L23/34 主分类号 H01L23/34
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