PLASMA TREATING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To contrive to reduce a suction force generated between a substrate and a substrate holding board due to a residual charge by a method wherein recessed parts are formed in the substrate installation surface of the substrate holding board so that the area of the substrate installation surface is formed in a specified ratio to the plane area of the substrate. SOLUTION: A contact part 3A comes into contact with a substrate 2 on the continued surface of the outer peripheral edge part of the substrate 2 on a substrate holding board. A contact part 3c is provided concentric with the surface of the contact part 3A and inside of the contact part 3A and is formed into a strip form. The contact surfaces of the contact parts 3A and 3c with each other are formed into a form of a roughly same width from the outer peripheral edge part of the substrate and the total area of the contact parts 3A and 3c is formed so that the total area is formed in an area higher than 5% to lower than 15% of the plane area of the substrate. A curved surface part 3B is formed in a recessed part formed in the holding board. A recessed part 3D is a part being formed into a recessed shape in the surface, which does not come into contact with the substrate, of the holding board. A recessed part 3E is formed into a form recessed more than the recessed part 3D. Thereby, the generation of dusts at the time when the substrate 2 to be treated is electrostatically sucked to the holding board can be reduced and a residual suction at the time when the electrostatic suction is stopped can be dissolved.