| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor integrated circuit and to provide a lead frame wherein possibility of malfunction due to noise is reduced. SOLUTION: A lead frame 1 comprises almost rectangular first and second island parts 12 and 13, arranged side by side, where an IC chip 2 and pin photodiode 3 are placed, and a plurality of lead parts 14-16 extending outward from near the end edge of the first island part 12. Here, a lead part 14 adjacent to the second island part 13 is provided with a tilted part 14a tilted against a side of the first island part 12, with one side 13b of the second island part 13 almost parallel to the tilted part 14a. |
