| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with a stiffener made of metal which does not obstruct mounting of an electronic component and can be miniaturized. SOLUTION: In a wiring board 1 where an electronic component 105 different from a semiconductor element 100 is mounted on a part position of an aperture 26 of a hole or a notch formed in a stiffener 21 made of metal, an insulating layer 31 is formed on a wall surface 26a of the aperture 26. Since the insulating layer 31 is formed on the wall surface 26a, possibility of shortcircutting is excluded, so that the aperture 26 can be miniaturized to the limit size capable of insertion of the electronic component 105. Thereby strength of the stiffener 21 can be increased as completely as possible, and the wiring board 1 can be miniaturized.
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