| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively and also easily obtain a non-contact data carrier by forming a planar coil where the mounting method of an IC chip is easy while maintaining sufficient strength and heat resistance as a supporting body in a transfer mold mode. SOLUTION: An antenna coil 2 is molded integrally with a lead frame 4 on which an IC chip 1 is mounted from a sheet having electrical conductivity such as copper and a copper alloy and made to be the planar antenna coil 2. The chip 1 is mounted on a mount pad 4a of the lead frame 4 and wire bonding mounting is performed, or the chip 1 is subjected to flip chip mounting on a bonding pad 2a of the coil 2 serving also as the pad 4a. The frame 4 on which the chip 1 is mounted is subjected to transfer formation and this non-contact data carrier can be obtained. |
