| 摘要 |
PROBLEM TO BE SOLVED: To protect and strengthen the rear surface of an IC chip at a low cost and to reduce a fault occurrences in the IC chip in a non-contact data carrier on which the thin IC chip is mounted by a flip chip method. SOLUTION: A sealing resin film (21) is formed on the rear surface and side faces of a silicone wafer (20) on which a circuit pattern is formed with thermosetting resin such as epoxy resin, or a resin sheet such as polyethersulfane and a metal sheet (23) such as aluminum are adhered with an adhesive 24 such as the epoxy resin. Next, an IC chip 10 where a rear surface protective layer 12 is formed on the rear surface is obtained by dicing the wafer (20). Subsequently, the chip 10 is mounted on a thin film-shaped antenna coil 1 formed on a resin sheet 2 by a flip chip method. A non-contact data carrier is obtained by adhering another resin sheet 2 on the sheet 2 and sealing with the sheets 2 and an adhesive layer 4.
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