| 摘要 |
PROBLEM TO BE SOLVED: To connect together a semiconductor element and a wiring board in a short time by the conductive filament bodies to improve connecting reliability by providing adhesive layers fusing by heat on both faces of an insulating core layer filled with the conductive filament bodies, and revealing electric conductivity by thermocompression bonding only in the thickness direction. SOLUTION: On both faces of a core material 12 having an insulation property and filled with conductive filament bodies 11 having smooth surfaces in the thickness direction of an insulating film 12a, adhesive layers 13 which fuses by heat are provided. The adhesive layer 13 consists of deformable electrical conductive particles uniformly dispersed therein, the conductive filament bodies 11 penetrate the core material 12 in the thickness direction, and project from the surface of the core material 12. The conductive filament body 11 is buried in the adhesive layers 13 provided on both sides of the core material 12, and reveals conductivity only in the thickness direction by thermocompression bonding. Hereby, the metallic projections 18 of the semiconductor connecting terminals 17 of a semiconductor element 15 can be surely and quickly connected to the wiring board connecting terminals 19 of a wiring board 16 through the conductive filament bodies 11 to improve reliability. |
