SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide the semiconductor pressure sensor which prevents its pedestal from breaking owing to the heat shrinkage of solder and has high reliability. SOLUTION: A semiconductor substrate 1 which has a diaphragm 11 and the pedestal 21 having a pressure intake hole 21 for introducing pressure into the diaphragm 11 are joined together and the pedestal 2 is fixed to a package 3 to constitute the semiconductor pressure sensor. A pressure intake hole 21 is formed projecting from a die 31 of the package 3, the pressure intake pipe 34 is inserted into the pressure intake hole 21 of the pedestal 2, and a thermosetting body 9 is interposed between the external surface of the pressure intake pipe 34 and the internal surface of the pressure intake hole 21 of the pedestal 2 and hardened by being heated to fix the pedestal 2 and package 3.