| 摘要 |
PROBLEM TO BE SOLVED: To provide a TAB tape for BGA, and a BGA package in which the leakage of resin due to transfer mold can be prevented and yield and productivity of product can be improved. SOLUTION: An insulating film 11 applied with adhesive is provided with via holes 12 for solder balls through punching work. The insulating film 11 is applied with a copper foil on which a wiring pattern 15, and lands 13a, 13b are formed. The lands 13a are provided in the region for mounting a semiconductor element, while the lands 13b are provided on the outside thereof, and the diameter of the land 13b is set larger than that of the land 13a. According to the arrangement, the land 13b is prevented from being stripped from an adhesive layer, and leakage of resin due to transfer mold can be prevented. |
