METHOD FOR CONDITIONING A PAD USED FOR POLISHING A FOR COPPER-BASED SEMICONDUCTOR WAFER
摘要
A method of conditioning pads (2) used in the polishing of semiconductor wafers containing copper circuitry. The method includes applying a treatment solution that contains a reactant for particulate copper-containing debris on the pad (2) resulting from the copper circuitry. Preferably, the reactant is a carboxylic acid present in a concentration of from about 0.1 to about 10 weight percent in a solution. The pH of the solution may be adjusted to the range from about 1 to about 6 with a compatible base.
申请公布号
WO0051783(A1)
申请公布日期
2000.09.08
申请号
WO2000US05670
申请日期
2000.03.03
申请人
SPEEDFAM-IPEC CORPORATION
发明人
LAURSEN, THOMAS;GRIEF, MALCOLM, K.;BASAK, SANJAY;MURELLA, KRISHNA, P.