| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability of package, especially moisture resistance, by preventing intrusion of moisture to the terminal electrode side of a semiconductor chip along a feeder line in the structure of a ball grid array(BGA) package provided with an electrode in the center of the semiconductor chip. SOLUTION: A wiring pattern 8 comprising a circuit pattern 22, which includes leads and lands and a feeder line 13 for electroplating the circuit pattern 22 is provided integrally on a tape base material 7, a punched part 17 or 20 is formed to intersect the feeder line 13, in order to disconnect the circuit pattern 22 electrically from the feeder line 13 after electroplating, and a film elastomer 3 is bonded to wiring pattern side. In such a tape carrier 2, the feeder line 13 exposed to the punched part 17 or 20 is covered with resin 15 or an elastomer adhesive, in order to prevent intrusion of moisture from the feeder line 13.</p> |
