| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer chip capacitor capable of obtaining satisfactory transfer characteristic over a wide frequency range. SOLUTION: A dielectric part 3 has a structure divided into an upper part and a lower part, by a first dielectric which has a specific permitivity and a second dielectric having high permitivity, as compared with the first dielectric. It has a small capacitance side wherein a first dielectric 4 is sandwiched by a part of an internal electrode for parallel lamination, connected with a first common electrode 1 and a part of an internal electrode for parallel lamination connected with a second common electrode 2, and a large capacitance side, wherein the remaining internal electrode for parallel lamination connected with the first common electrode 1 and the residual internal electrode for parallel lamination connected with the second common electrode 2 sandwich the second dielectric in a telescopic state. |
