| 摘要 |
PROBLEM TO BE SOLVED: To realize a method of manufacturing a wiring board, wherein a through-hole conductor layer can be formed at a high density, mechanical strength of an insulating substrate is strong, and the conduction of a wiring conductor layer and the like is made without fail. SOLUTION: A plurality of photo-curing ceramic sheets 1a, each having through-holes 3, are formed by irradiating a photosensitive ceramic green sheet 1 with rays of light at prescribed positions. Then, a wiring conductor layer 4a is formed on at least one of the sheets 1a, and a power supply or ground wiring layer 6 and an auxiliary wiring layer 7 are formed on at least another one of the sheets 1a. Thereafter, both sheets 1a are laminated one upon another and sintered. |
