| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve efficiency by comprising a process for applying an electric field between two sheets of substrates respectively, comprising an elemental electrode of each element and a wiring connected to the electrode in the shape of a ladder or a matrix, and placed facing opposite to one another in a state in which the wirings are faced inwardly. SOLUTION: An electric field application process for removing factors which induce the discharge phenomenon such as projection and contamination in advance, is executed after the wiring is formed on an electron source substrate (before the formation of a conductive film). An electron source substrate 218 is fixed on a mechanical stage 217, and the other electron source substrate 219 is fixed on the bottom of a substrate holder 211. The matrix wirings of the electron source substrates 218, 219 are electrically connected in common by a conductive getter 213 at the ends of the wirings, and connected to GND and a high-tension power source 221 by the cables 215, 216 and the like to equalize the wiring potential of two sheets of electron source substrates 218, 219. Since two sheets of electron source substrates 218, 219 are treated with one electric field application process, manufacturing efficiency can be improved, and cost can be reduced, so that an image forming device can be provided more inexpensively.</p> |
