发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, PROCESS FOR PRODUCING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD
摘要 <p>A photosensitive resin composition which comprises: (A) a carboxylated binder polymer containing comonomer units derived from styrene or a derivative thereof, (B) a photopolymerization initiator, and (C) at least one photopolymerizable compound which has at least one polymerizable, ethylenically unsaturated bond per molecule and comprises as an essential component a compound represented by general formula (I) (wherein R1 represents hydrogen or methyl; A represents alkyleneoxy; Z1 represents halogeno, alkyl, cycloalkyl, aryl, amino, alkylamino, dialkylamino, nitro, cyano, mercapto, alkylmercapto, allyl, hydroxyalkyl, carboxyalkyl, acyl, alkoxy, or a group containing a heterocycle; m is an integer of 4 to 20; and n is an integer of 0 to 5).</p>
申请公布号 WO2000052529(P1) 申请公布日期 2000.09.08
申请号 JP2000001221 申请日期 2000.03.02
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