| 摘要 |
PROBLEM TO BE SOLVED: To enhance an interposer board in bonding strength to a circuit board. SOLUTION: A semiconductor chip 30 is mounted on one surface 10a of an interposer board, and lands which are bonded to a circuit board are formed on the other surface 10b. In this case, the lands are composed of electrode lands 11a electrically connected to the circuit board and dummy lands 11b which are each larger in area than the electrode land 11a and formed only on the regions of the interposer board that correspond to the four corners of the semiconductor chip 30 mounted on the interposer board. |
