| 摘要 |
PROBLEM TO BE SOLVED: To stably supply electronic components eliminating a risk that the accommodation part is covered with a top tape at the pick up of an electronic components in an electronic component supplying apparatus for picking up an electronic components by carrying the carrier tape accommodating electronic components in the accommodation section and then peeling the tap tape covering the surface thereof. SOLUTION: A peeling section 12 for peeling a top tape 5 is formed of a peeling and extracting cutout section 17, formed at a tape pressing body 16 and a thin plate 18, arranged at the forward part in the carrying direction of the peeling and extracting cutout section 17 of the tape pressing body 16. The thin plate 18 is provided with a sloping section 19, having an arc-shape section 20 and is also provided with a recess 21 for elastic deformation of the thin plate 18 in the forward part in the carrying direction of the peeling and extracting cut-out section 17 of the tape pressing body 16. |
