| 摘要 |
<p>PROBLEM TO BE SOLVED: To automatically discriminate the quality of semiconductor chips based on whether or not a magnetic material layer is present on the side of the semiconductor chip, when the semiconductor chips are cut off by a method wherein a magnetic material layer is provided in the side of a semiconductor wafer with a primary surface, where electronic elements or patterns are physically and chemically formed. SOLUTION: A magnetic material layer 4, composed of magnetic powder and binder which binds magnetic powder together, is previously applied on the side of a semiconductor wafer laminate. Lastly, when a magnet is made to approach separated semiconductor chip laminates 8, the semiconductor chip laminate 8 with the magnetic material layer 4 formed on its side is attracted by the magnet. The semiconductor chip laminate 8 having no magnetic material layer 4 formed on its side is not attracted to the magnet. As a result, the semiconductor chip laminates 8 which are possessed of arc-shaped sides, defective in shape, and not suitable for use in the manufacture of products can be easily and surely sorted out.</p> |
