| 摘要 |
PROBLEM TO BE SOLVED: To prevent the electrostatic breakdown of a semiconductor chip in a resin sealing process with molding resin when manufacturing a BGA(ball grid array). SOLUTION: On an upper and a lower face of a circuit board 25a, circuit patterns 21a, 21b are formed respectively. On the circuit pattern 21a, protective films 22a and 23a are formed in order. A protective film 22b is formed on the circuit pattern 21b and a land 24 is extended from the circuit pattern 21b. The protective films 23a has a conductivity. Because of this structure, when the circuit board 25a is released from an upper mold 40 after sealed with molding resin, generation of static electricity is suppressed. Therefore, static electricity applied to a semiconductor chip 30 is reduced and the electrostatic breakdown of the semiconductor chip 30 can be prevented. |
