| 摘要 |
PROBLEM TO BE SOLVED: To improve anticorrosion of a nickel plating film to be stuck on the surface of a wiring conductor formed on the surface of an insulating board. SOLUTION: In a wiring board, a wiring conductor is formed on the surface of an insulating base, and a nickel plating film containing 0.05-3 wt.% of boron and 0.005-0.08 wt.% of sulfur and a gold plating film are stuck on the surface of the wiring conductor in order. Anticorrosion and solder wettability can be improved without deteriorating conductivity of the plating films, and electronic components can be excellently mounted and stably operated for a long time.
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