| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspecting apparatus for semiconductor devices with a constitution whereby leads of the semiconductor devices can be surely brought in contact with measurement terminals of the apparatus. SOLUTION: The inspecting apparatus is in the same constitution as conventional inspecting apparatuses except a chip placement part 40. The chip placement part 40 has a contact sheet 48 set to an upper face thereof. The contact sheet has a suction area 42 for sucking through contact with a chip lower face, measurement terminals 44 disposed at each side of the area and a suction opening 46 connected to a vacuum suction device. The contact sheet is mounted to a chip placement part main body 52 by screwing at sheet fix holes 50. The contact sheet is formed of a ceramic-based porous substance. The suction area has a shape and a size nearly equal to the chip lower face of a semiconductor device to be inspected and functions as a suction face. The measurement terminals are arranged to both sides of the suction area to agree with an arrangement of leads of the semiconductor device and set penetrating a sheet main body. The contact sheet is covered with a seal layer for air-tightly sealing the sheet main body except a face of the suction area and measurement terminals.
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