发明名称 AMORPHOUS BARRIER LAYER IN A FERROELECTRIC MEMORY CELL
摘要 A ferroelectric cell (70), particularly on a silicon substrate (22) comprisi ng an amorphous barrier layer (72) interposed between the ferroelectric stack a nd the silicon. Preferably, the ferroelectric stack includes conductive metal oxide electrodes sandwiching the ferroelectric layer. The metal oxide may ac t as a templating layer to crystallographically orient the ferroelectric layer . Alternatively, the electrodes and ferroelectric layer may be polycrystalline . The amorphous barrier layer (72) may be composed of an intermetallic alloy, such as Ti3Al, a metal-metalloid, such as Pd-Si, a combination of early and later transition metals, such as Ti-Ni, and other related compound metal systems, such as (Ti, Zr)-Be, that form amorphous metals.
申请公布号 CA2365840(A1) 申请公布日期 2000.09.08
申请号 CA20002365840 申请日期 2000.03.01
申请人 TELCORDIA TECHNOLOGIES, INC.;UNIVERSITY OF MARYLAND 发明人 RAMESH, RAMAMOORTHY;AGGARWAL, SANJEEV
分类号 H01L21/02;H01L21/768;H01L27/115;(IPC1-7):H01G4/06;H01B12/00 主分类号 H01L21/02
代理机构 代理人
主权项
地址