| 摘要 |
PROBLEM TO BE SOLVED: To contemplate miniaturization, thinning and cost reduction on a mounting structure of a semiconductor device socket, for mounting the semicon ductor device socket, where a semiconductor device is mounted, on a testing circuit board. SOLUTION: In this mounting structure of a semiconductor device socket for mounting, on a testing circuit board 33, a semiconductor device socket 30A composed by arranging, in a socket body 31, a contact film 38A composed by forming an extended conductor wiring 40 extended from a contact part 39 connected to a semiconductor device 1, a socket side connector 34A connected to the extended conductor wiring 40 is installed on the contact film 38A, and a circuit board side connector 35 opposite to the socket side connector 34A is installed on the testing circuit board 33. The socket side connector 34A and the circuit board side connector 35 are composed so as to have mutually a male-female relation.
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