发明名称 HEAT SINK DEVICE
摘要 PROBLEM TO BE SOLVED: To enable a heat sink device, integrated with a fan motor to be installed in a thin-type equipment by eliminating space in an air suction side which prevents thinning of the equipment. SOLUTION: A space which is large enough to suck air to the upper surface of a heat sink device can be obtained by making the height of a fan 6 and a fin part of a heat sink smaller than a drive means part of a motor, etc., whose structural thickness is limited. The shape of a heat sink base 2 and a fin is formed into a structure of exhaust only in one direction, and a cover 5 is provided to a suction side to prevent exhaust from creeping to suction to compensate for the lowered cooling ability caused by size reduction of the fan 6 and the fin part of a heat sink. According to this constitution, it is possible to set up a structural body in the upper part of a heat sink device near the height of the motor 3, and a heat sink device can be installed in a thin type equipment.
申请公布号 JP2000244163(A) 申请公布日期 2000.09.08
申请号 JP20000076091 申请日期 2000.03.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYAHARA MASAHARU;INOUE YASUSHI;SUGA KENJI
分类号 H05K7/20;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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