| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer transfer method and a device, where the device is capable of transferring a semiconductor wafer without coming into contact with it during a time from the delivery of it to the mounting of it on a susceptor. SOLUTION: A pressure between a susceptor 2 and a wafer 1 is kept high enough to support the weight of a wafer 1 by making gas flow from below the susceptor 2, and then gas injected from below the susceptor 2 is sopped or lessened, by which a pressure between the susceptor 2 and the wafer 1 is gradually decreased, the wafer 1 is housed in the susceptor 2, and a film can be formed on the wafer 1 or the wafer 1 can be thermally treated while the wafer 1 and the susceptor 2 are kept in a prescribed positional relation between them. |
