发明名称 MULTILAYER PRINTED WIRING BOARD AND PACKAGING STRUCTURE OF CHIP-TYPE THREE-TERMINAL NOISE FILTER USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, capable of exhibiting the intrinsic noise-removing effect of a noise filter without reducing the effect, when a plurality of noise filters are arranged in series to remove noises, and a packaging structure of a chip-type three-terminal noise filter using the same. SOLUTION: In this structure, a grounded conductor 2 connected to the ground electrode 6 of a noise filter 5 is connected to a grounded body 3, formed on the reverse surface of a multilayer printed wiring board 1 and an inner layer grounded conductive body 10 in the multilayer printed wiring board 1 via a through-hole 4 made near the grounded electrode of the noise filter 5. This firmly connects the grounded electrode 6 of the noise filter 5 to the grounded body 3, which is formed on the reverse surface of the multilayer printed wiring board 1 to reduce the value of the inductance arranged, in series with a high-frequency current circuit to a very small value to reduce noise voltage produced in the grounded electrode of the noise filter. Therefore, this increases the noise-removing effect of noise filter and fully exhibits the effect.</p>
申请公布号 JP2000244128(A) 申请公布日期 2000.09.08
申请号 JP19990046872 申请日期 1999.02.24
申请人 CANON INC 发明人 TAKEUCHI YASUSHI
分类号 H05K1/02;H03H7/01;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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