| 摘要 |
<p>PROBLEM TO BE SOLVED: To clean a board without causing readhesion of a dissolving substance from the board, and to equalize the surface energy of the board at the same time. SOLUTION: When the surface treatment of a board on the surface of which at least printed wiring is formed is performed, an aqueous cleaning agent containing a surface-active agent (anionic, cationic or nonionic surface active agent) that dissolves in water and does not decompose in water, and an organic silicon compound that is water-soluble and having residual property, that is, hard to volatilize is used.</p> |
