| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a method for bonding an IC chip to a support substrate, in which a solder bump can be formed at an aluminum bonding position. SOLUTION: In order to form a solder bump at a bonding position of Al, under bump metal(UBM) layers 21, 22, 23 are formed at first at a solder bump position. A cap layer 14 on an IC chip is coated with photoresist and patterned, to expose an UBM and the peripheral part of the cap layer around the UBM. Subsequently, solder paste 62 is applied and subjected to reflow, thus forming a solder bump 71. Since solidified photoresist is difficult to remove after reflow step, a sacrificial buffer layer 21 is provided between a photoresist mask 51 and the cap layer 14, thus facilitating removal of a photoresist 51.</p> |
