发明名称 SEMICONDUCTOR MANUFACTURING MOLD DEVICE
摘要 PROBLEM TO BE SOLVED: To enable a mold device to be improved in productivity and operating efficiency by a method, wherein a molding die different in specifications from a dedicated molding die is provided inside the mold device, and a die jig suitable for the mold device is provided. SOLUTION: A die jig 11 is equipped with an upper frame-type cavity holder presser 12u and a lower frame-type cavity holder presser 12b, which fill up gaps inside the mold device of W-type coming into close contact with the outer peripheries of cavity holders 102Su and 102Sb, so as to mount a mold die of an S type in a mold device of W type. An upper frame-type cavity holder receiver 13u and a lower frame-type cavity holder receiver 13b are laminated on or under the upper frame-type cavity holder pressure 12u and the lower frame- type cavity holder presser 12b to fill up a gap in the mold device, coming into close contact with the outer peripheries and upper and lower peripheral edges of the cavity holders 102Su and 102Sb and fixed, with fixing screws 14.
申请公布号 JP2000243770(A) 申请公布日期 2000.09.08
申请号 JP19990046775 申请日期 1999.02.24
申请人 TOSHIBA CORP 发明人 YOSHIMURA SHUNSUKE
分类号 H01L21/56;B29C33/00;B29C33/30;B29C33/76;(IPC1-7):H01L21/56 主分类号 H01L21/56
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