| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate whose outer peripheral edge of a semiconductor layer does not easily become a source of chipping or dusting, and also to provide a method for manufacturing the substrate. SOLUTION: In a semiconductor substrate 5 having a carrier base body 1, an insulating layer 2 disposed on the base body 1, and a semiconductor layer 3 disposed on the insulating layer 2; an outer peripheral end 3A of the semiconductor layer 3 is located inside an outer peripheral end 1A of the base body 1, an outer peripheral end 2A of the insulating layer 2 is located between the end 3A of the semiconductor layer 3 and the end 1A of the base body 1, and outer peripheries 10 of the layers 2 and 3 are formed stepwise.
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