SYSTEM AND METHOD FOR APPLYING A METAL LAYER TO A SUBSTRATE

摘要

The present invention relates to systems and methods for applying metal shielding coatings on substrates. More particularly, EMI/RFI shielding coatings are applied using an HVOF thermal sprayer adapted to increase the velocity of the molten metal particles. The shielding coatings have an adhesion characteristic and electrical conductivity level that is an improvement over the prior art shielding coatings.