发明名称 |
HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC COMPONENTS, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS |
摘要 |
A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved. |
申请公布号 |
EP1032946(A1) |
申请公布日期 |
2000.09.06 |
申请号 |
EP19980954743 |
申请日期 |
1998.11.19 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MINAMITANI, SHOZO;HOSOTANI, NAOTO;MORITA, KOICHI;ONOBORI, SYUNJI;NISHINO, KENICHI |
分类号 |
H01L21/00;H01L21/56 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|