发明名称 Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin
摘要 An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.
申请公布号 US6114450(A) 申请公布日期 2000.09.05
申请号 US19990304610 申请日期 1999.05.04
申请人 INTERNATIONAL BUSINESS CORPORATION 发明人 SACHDEV, KRISHNA GANDHI;BERGER, MICHAEL;CALL, ANSON JAY;POMPEO JR., FRANK LOUIS
分类号 C08L61/06;C08L61/14;C09D179/04;C09J163/00;C09J163/02;C09J179/04;H01L21/58;(IPC1-7):C08K3/08;C08L63/00;C08L63/02;C08L79/00 主分类号 C08L61/06
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