发明名称 |
Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin |
摘要 |
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.
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申请公布号 |
US6114450(A) |
申请公布日期 |
2000.09.05 |
申请号 |
US19990304610 |
申请日期 |
1999.05.04 |
申请人 |
INTERNATIONAL BUSINESS CORPORATION |
发明人 |
SACHDEV, KRISHNA GANDHI;BERGER, MICHAEL;CALL, ANSON JAY;POMPEO JR., FRANK LOUIS |
分类号 |
C08L61/06;C08L61/14;C09D179/04;C09J163/00;C09J163/02;C09J179/04;H01L21/58;(IPC1-7):C08K3/08;C08L63/00;C08L63/02;C08L79/00 |
主分类号 |
C08L61/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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