发明名称 |
Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat |
摘要 |
A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.
|
申请公布号 |
US6113463(A) |
申请公布日期 |
2000.09.05 |
申请号 |
US19960623771 |
申请日期 |
1996.03.29 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD.;FUJIKOSHI MACHINERY CORP. |
发明人 |
HASEGAWA, FUMIHIKO;KUROKA, YASUYOSHI;TSUCHIYA, TOSHIHIRO;ICHIKAWA, KOICHIRO;INADA, YASUO |
分类号 |
B24B9/00;B24B9/06;B24B49/02;B24B49/12;(IPC1-7):B34B49/00;B34B9/02 |
主分类号 |
B24B9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|