发明名称 SUBSTRATE HEATING DEVICE HAVING COOLER
摘要 PROBLEM TO BE SOLVED: To not only heat a substrate, but also to cool the substrate sufficiently. SOLUTION: A substrate heating device having a cooler comprises a soaking plate 10 excellent in heat conductivity to uniformly heat a substrate (a) under uniform temperature distribution, plural sets of heaters 25, 26 which are separately embedded on an outer peripheral side and an inner peripheral side of the soaking plate 10, a clearance part 24 which is formed between the heaters 25, 26 of the soaking plate 10 and free from any heaters 25, 26, and a cooler 13 which is on the back side of the soaking plate 10 to cool the substrate (a) through the soaking plate 10. This device is provided with a heating plate 1 on which the substrate (a) is placed, and the soaking plate 10 is arranged in contact with the back side of the heating plate 1.
申请公布号 JP2000239847(A) 申请公布日期 2000.09.05
申请号 JP19990044324 申请日期 1999.02.23
申请人 SUKEGAWA ELECTRIC CO LTD 发明人 ABE YUJI;MIURA KUNIAKI;ASAHA MAKOTO;TERUYAMA YUZO
分类号 H01L21/205;C23C16/46;H01L21/285;H01L21/324;(IPC1-7):C23C16/46 主分类号 H01L21/205
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