| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a heat resistant resin paste capable of exhibiting a thixotropic property without using a filler such as silica fine particles or insoluble polyimide fine particles, forming a uniform thick film pattern excellent in reliability without having voids or bubbles by a screen printing method, having less dust or ionic impurities and also excellent in productivity. SOLUTION: This heat resistant resin paste is produced by mixing and heating (I) a polyimide resin or polyamideimide resin A dissolvable with a solvent (III) at a room temperature or its heating for drying temperature with (II) a polyimide resin B not dissolvable with the solvent (III) at a room temperature but dissolvable at its heating for drying temperature and the solvent (III) for dissolving them, and cooling the obtained solution for precipitating and dispersing fine particles of the polyimide resin B of (II) in the solution of the polyimide or polyamideimide resin A of (I) with (III), wherein the above polyimide resin or the polyamideimide resin are treated by filtering a polyamic acid that is a precursor of the above resins.
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