Device for the encapsulated reception of a material

摘要

PCT No. PCT/EP97/00373 Sec. 371 Date Jan. 4, 1999 Sec. 102(e) Date Jan. 4, 1999 PCT Filed Jan. 28, 1997 PCT Pub. No. WO97/34697 PCT Pub. Date Sep. 25, 1997An encapsulating device having a material encapsulated therein comprises a basic body provided with a recess for receiving therein the material and formed by microsystem technology in such a way that the material is fully arranged within the recess. A diaphragm extends across the basic body and is implemented in microsystem or thin-film technology. The diaphragm is used for encapsulating the material in the recess of the basic body in such a way that the diaphragm extends in spaced relationship with the material. An electrically actuable heating means is provided for destroying the diaphragm so as to expose the material.