| 摘要 |
PROBLEM TO BE SOLVED: To prevent the deterioration of a pad at the time of peeling a wafer by selectively communicating a vacuum source and a liquid supply source with a suction hole of a suction board through a tube member with a switching means, and vacuum sucking a wafer placed in the top surface through the pad or jetting the liquid to the wafer. SOLUTION: In the case where a suction hole of a suction board 54 is connected with a vacuum source 128 by a switching valve 127, outside air is sucked through the suction hole of the suction board 54 provided in the upper end of a tube member 125, and a wafer W placed in the top surface through a pad P is sucked. When changeover of connection from the vacuum source 128 to a water supply source 129 is performed by the switching valve 127, water is jetted from the suction hole so as to easily separate the wafer W from the pad P. Further, abrasive grains left in the inner surface of the pad P is flowed out by the water passing through the pad P, and the inside of the pad P is impregnated with the water so as to be maintained in the wet condition, and a change due to dryness is prevented. |
