| 摘要 |
PROBLEM TO BE SOLVED: To obtain a die-attaching paste not deteriorating in hot adhesive strength, is rapid-curing, and not causing void formation by including a thermosetting resin having a specified nitrogen content with an inorganic filler as the essential components. SOLUTION: This paste contains a normally liquid thermosetting resin having a nitrogen content of 2-10 wt.% and an inorganic filler. The thermosetting resin comprises a liquid cyanate resin, an epoxy, resin, a like resin, a curing agent such as an aliphatic or aromatic amine, dicyandiamide, or a dicarboxylic dihydrazide, and a cure accelerator such as 2-methylimidazole or 2- phenylimidazole. The inorganic filler is exemplified by a silver powder or a silica filler. The silver powder desirably has a mean particle diameter of 2-10μm and a content of impurities such as halide ions of 10 ppm or below, and the silica filler is one having a mean particle diameter of 1-20μm. If required, the paste additionally contains additives such as a silane coupling agent, an antifoam, and a surfactant. |
