| 摘要 |
PURPOSE: A multi-layered type chip and a manufacturing method thereof are provided to improve taping efficiency of a chip and to structurally prevent the contact inferiority between an interior chip and an exterior chip as well as the breakdown of the chip due to the permeation of moisture into the chip during abrasion. CONSTITUTION: A multi-layered type chip includes a main body(100) formed of a plurality of ceramic layers(110) repeatedly stacked and printed with an inner electrode pattern(150) on surface and outer electrodes(200) formed at both sides of the main body and having a post layer(201) in a size for covering an exposed end part of the inner electrode pattern for preventing degrading of the property of the chip due to the absorption of moisture and upper and lower extended layers(203,205) respectively extended from the post layer upward or downward. The post layer of the outer electrodes includes a plated layer to be electrically connected to the exposed end part of the inner electrode pattern and formed by the steps of forming a via hole, filling the via hole with conductive substances and performing cutting for forming the main body. |
