| 摘要 |
PROBLEM TO BE SOLVED: To obtain a metal thin film in an easy process at an economical cost by forming a coating film from a coating material containing metal colloid particles obtd. by reducing a noble metal or copper compd. in the presence of a polymer dispersant and then heating the coating film to melt and fix the colloid particles. SOLUTION: A coating material containing a noble metal or copper colloid particles is applied on a substrate 1. After the application, the coating material is dried to remove the solvent in the coating material and to form a coating film. The coating film contains the noble metal or copper colloid particles and a polymer dispersant. Then the coating film is heated to melt and fix the colloid particles to form a metal thin film 2. The metal thin film 2 generally has electric conductivity and metal gloss like a plating film. Therefore, the film can be used to form conductive circuits such as electrodes and wiring. In order to pattern the film to form a conductive circuit, the coating material may be applied by a screen printing method, or the like. |
