发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND BLACK MATRIX PREPARED THEREFROM
摘要 PURPOSE: A photosensitive resin composition having excellent heat-resistant property, chemical-resistant property and adhesive property and a black matrix prepared therefrom are provided. CONSTITUTION: Regarding 100 parts by weight of total photosensitive resin composition, the photosensitive resin composition comprises: (i) 1-40 parts by weight of a cardo binder resin prepared by copolymerizing components of the following formulae 1(A), 2(B) and 3(C); (ii) 1-20 parts by weight of a photopolymerizing monomer; (iii) 0.1-10 parts by weight of a photopolymerizing initiator; (iv) 5-20 parts by weight of a black paint; (v) 0-10 parts by weight of an epoxy substance; (vi) 20-80 parts by weight of a solvent; and (vii) 0.01-1 parts by weight of a silane coupling agent having either an epoxy group or an amino group. In the formula, R is one selected from the group consisting of hydrogen, C1-10 alkyl, allyl, phenyl, benzyl and C1-8 epoxy and X is a halogen atom. The black matrix for an electronic display device is prepared from the photosensitive resin composition.
申请公布号 KR20000055255(A) 申请公布日期 2000.09.05
申请号 KR19990003780 申请日期 1999.02.04
申请人 CHEIL INDUSTRIES INC. 发明人 JEONG, JUN HO;SEONG, NAM SIK;JO, JUN SIK;KIM, BYUNG JU
分类号 G03F7/004;G03F7/027 主分类号 G03F7/004
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