发明名称 REACTIVE DILUENT AND CURABLE RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To obtain a reactive diluent being solid at a room temperature, having excellent curing characteristics and viscosity reducing properties, low skin irritation and excellent adhesion of a composition before curing to a substrate as a polymerizable monomer for curing, a curable resin composition containing the reactive diluent and to provide its use. SOLUTION: This reactive diluent contains an N-vinylacetamide of a polymerizable monomer containing a polar group and having 54-55 deg.C melting point. Consequently the reactive diluent does not impair curing characteristics as a curing resin composition curable by heat, active light rays, etc., and has excellent viscosity reducing properties and low skin irritation. A curable resin composition and its use are provided.</p>
申请公布号 JP2000239327(A) 申请公布日期 2000.09.05
申请号 JP19990039484 申请日期 1999.02.18
申请人 SHOWA DENKO KK 发明人 KAMATA HIROTOSHI;YAMAGUCHI TETSUHIKO
分类号 C08F290/00;C08F226/02;C09D11/033;C09D11/10;C09D11/101;C09D11/104;C09D11/106;C09D139/00;(IPC1-7):C08F226/02 主分类号 C08F290/00
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