Method of filling an aperture in a substrate

摘要

An aperture in an electronic substrate is filled with a filling material without need for a specially built fill mask. A layer of tape or tentable photosensitive dielectric film is applied to one surface of the substrate covering the aperture. An opening is made in the tape or film by directing radiation through the aperture. Fill material is then forced through the opening to substantially fill the aperture. Protruding nubs may be removed to planarize the substrate surfaces.