发明名称 |
Method for manufacturing a semiconductor device having fine contact hole with high aspect ratio |
摘要 |
A semiconductor device includes at least one hole formed on a semiconductor substrate. A barrier method is formed on at least one portion in contact with the semiconductor substrate in the hole. A metal interconnection is constituted by two layers including a first Al-containing metal film formed on the barrier metal, and a second Al-containing metal film formed on the first Al-containing metal film and having a melting point lower than the melting point of the first Al-containing metal film.
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申请公布号 |
US6114244(A) |
申请公布日期 |
2000.09.05 |
申请号 |
US19970910020 |
申请日期 |
1997.08.12 |
申请人 |
NEC CORPORATION |
发明人 |
HIROSE, KAZUYUKI;KIKUTA, KUNIKO |
分类号 |
H01L23/485;H01L23/532;H01L29/45;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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